Patented mPCM built for the formulation line.
nextek™ delivers high thermal stability across a wide temperature range with a robust melamine capsule wall — an economical, readily dispersible mPCM for coaters, foam pourers, and compounders.
Formulating with nextek™.
nextek™ patented technology provides high thermal stability across a wide range of melt points with a robust capsule wall that survives high-temperature drying, lamination, coating-line shear, and foam and slurry processing.
Supplied as a ~40% solids slurry for wet-line addition, a ~70% solids cake for reduced water load, or a >97% solids powder for dry blending into polymers, gypsum, and compounds. Capsules are readily dispersible and carry low formaldehyde content.
Key benefits.
- Economical pricing structure at commercial volume
- Optimal cool-to-the-touch sensation
- High thermal stability across the full melt-point range
- Readily dispersible in aqueous and polymer systems
- Low formaldehyde content
Specifications at a glance.
Forms
- Slurry
- ~40% solids
- Cake
- ~70% solids
- Powder
- >97% solids
Thermal
- Melt points
- −10, 6, 18, 24, 28, 32, 37°C
- Enthalpy
- ~150–205 J/g (varies by temperature)
Chemistry
- Capsule wall
- Melamine-based
- Core
- Paraffin
- Formaldehyde
- Low content
Where nextek™ mPCM works.
Ready to engineer a better thermal solution?
Talk with a Microtek expert about your application — from concept to commercialization.